产品应用 Product application
服务器 Server 网通设备Netcom equipment
光电行业Photoelectric industry 芯片与散热模块之间 Between chip and cooling module
家电行业Home appliance industry 新能源电池New energy battery
导热原理 Heat conduction principle
用导热系数远高于空气的导热界面材料对散热模块及发热源之间进行充分填充，使结合面的热阻减少，从而达到降低热源温度的目的。
The thermal conductivity of interface material(TIM) is much higher than air’s and TIM is used to fully fill between the heat dissipation module and the heat source, so that the thermal resistance of the joint surface is reduced,and cooling the heat source.
性能参数 Product properties
|
项目 Item |
参数 parameter |
单位 Unit |
公差 Tolerance |
测试标准 Test Method |
|
颜色Color |
根据客户需求 Custom-made |
- |
- |
-- |
|
厚度(mm)Thickness |
0.2-14 |
mm |
- |
ASTM D374 |
|
导热系数(W/ K)Thermal Conductivity |
1.0 |
W/m.k |
±0.25 |
ASTM D5470 |
|
使用温度(℃) Temperature Range |
-50～180 |
℃ |
- |
EN344 |
|
硬度（Shore C）hardness |
10-55 |
Shore C |
±5 |
ASTM D2240 |
|
密度（g/cc）density |
2.2 |
g/cm3 |
±0.5 |
ASTM D792 |
|
压缩比(%)@50psi RatioCompression Ratio |
≥20 |
% |
- |
ASTM D575-1991 |
|
拉伸强度(MPa)Tensile Strength |
≥0.2 |
Mpa |
- |
ASTM D624 |
|
延伸率(%) Elongation |
≥75 |
% |
- |
ASTM D412 |
|
体积电阻率(Ω•cm) Volume Resistivity |
≥1.0*108 |
Ω.cm |
- |
ASTM D257 |
|
介电常数(@1MHz)Permittivity |
≥5 |
@1MHz |
- |
ASTM D 150 |
|
击穿电压(KV/mm) Breakdown Voltage |
≥8 |
KV/mm |
- |
ASTM D149 |
|
阻燃等级 Certify |
94-V0 |
- |
- |
UL94-2018 |
